An interconnect and system for establishing temporary electrical communication with semiconductor components having contact bumps are provided. The interconnect includes a substrate with patterns of contact members adapted to electrically contact the contact bumps. The substrate can be formed of a material such as ceramic, silicon, FR-4, or photo-chemically machineable glass. The contact members can be formed as recesses covered with conductive layers in electrical communication with conductors and terminal contacts on the substrate. Alternately, the contact members can be formed as projections adapted to penetrate the contact bumps, as microbumps with a rough textured surface, or as a deposited layer formed with recesses. The interconnect can be employed in a wafer level test system for testing dice contained on a wafer, or in a die level test system for testing bare bumped dice or bumped chip scale packages.