发明授权
- 专利标题： Cleaning and drying photoresist coated wafers
- 专利标题（中）： 清洁和干燥光刻胶涂覆的晶片
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申请号： US5976申请日： 1998-01-12
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公开(公告)号： US5932027A公开(公告)日： 1999-08-03
- 发明人: Raj Mohindra , Abhay Bhushan , Rajiv Bhushan , Suraj Puri , John H. Anderson, Sr. , Jeffrey Nowell
- 申请人： Raj Mohindra , Abhay Bhushan , Rajiv Bhushan , Suraj Puri , John H. Anderson, Sr. , Jeffrey Nowell
- 申请人地址： CA Mountain View
- 专利权人： YieldUP International
- 当前专利权人： YieldUP International
- 当前专利权人地址： CA Mountain View
- 主分类号： B08B7/04
- IPC分类号： B08B7/04 ; B08B3/10 ; G11B23/50 ; H01L21/00 ; H01L21/027 ; H01L21/304 ; H01L21/306 ; B08B3/04 ; B08B5/00
摘要：
A method for cleaning a semiconductor wafer. The method includes immersing a wafer in a liquid having water. The wafer has a front face, a back face, and an edge. The method also includes providing a substantially particle free environment adjacent to the front face and the back face as the liquid is being removed. A step of introducing a carrier gas having a cleaning enhancement substance during the providing step also is included. The cleaning enhancement substance dopes the liquid which is attached to the front face and the back face to cause a concentration gradient of the cleaning enhancement substance in the attached liquid to accelerate fluid flow of the attached liquid off of the wafer.
公开/授权文献
- USD352601S Case 公开/授权日：1994-11-22