发明授权
- 专利标题： Repairing fractured wafers in semiconductor manufacturing
- 专利标题（中）： 修复半导体制造中的断裂晶片
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申请号： US28966申请日： 1998-02-24
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公开(公告)号： US5932379A公开(公告)日： 1999-08-03
- 发明人: Jinwook Burm , Robert Alan Hamm , Rose Fasano Kopf , Robert William Ryan , Alaric Tate
- 申请人： Jinwook Burm , Robert Alan Hamm , Rose Fasano Kopf , Robert William Ryan , Alaric Tate
- 申请人地址： NJ Murray Hill
- 专利权人： Lucent Technologies Inc.
- 当前专利权人： Lucent Technologies Inc.
- 当前专利权人地址： NJ Murray Hill
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; G03F9/00
摘要：
The specification describes a technique for repairing wafer fractures that occur during wafer fabrication. The fractured pieces are joined edge-to-edge at the fracture line and bonded with epoxy adhesive. The method succeeds because the dimensions of the fracture line after bonding is within the reregistration tolerance of commercial step-and-repeat cameras and the reregistration capability of the camera allows normal exposure of sites that do not intersect the fracture line.
公开/授权文献
- USD363568S Cigarette caddy 公开/授权日：1995-10-24
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