发明授权
- 专利标题: Three dimensional package and architecture for high performance computer
- 专利标题(中): 高性能计算机的三维封装和架构
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申请号: US554009申请日: 1995-11-06
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公开(公告)号: US5935687A公开(公告)日: 1999-08-10
- 发明人: Evan Ezra Davidson , David Andrew Lewis , Jane Margaret Shaw , Alfred Viehbeck , Janusz Stanislaw Wilczynski
- 申请人: Evan Ezra Davidson , David Andrew Lewis , Jane Margaret Shaw , Alfred Viehbeck , Janusz Stanislaw Wilczynski
- 申请人地址: NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: NY Armonk
- 主分类号: H05K3/36
- IPC分类号: H05K3/36 ; H01L25/065 ; H05K1/05 ; H05K1/14 ; H05K3/34 ; H05K3/46 ; H05K7/14 ; B32B3/00
摘要:
A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies. Optionally, the outer surfaces of the structure that can be disposed a cube of memory chips.
公开/授权文献
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