A cutting apparatus that performs cutting operations without being held by an operator and that is applicable to various cutting operations in addition to forming a biscuit groove. The cutting apparatus comprises a first base portion having a mount surface on which a work is mounted; a second base portion having an abutment surface with which a work surface to be worked is brought into contact; and a cutter holding portion capable of holding a circular saw blade so as to extend beyond the abutment surface toward the work. The cutter holding portion is turnable, with respect to the second base portion, around an axis perpendicular to the abutment surface.