发明授权
- 专利标题： Stitch bond enhancement for hard-to-bond materials
- 专利标题（中）： 针对难粘结材料的针迹增强
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申请号： US158845申请日： 1998-09-23
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公开(公告)号： US5960262A公开(公告)日： 1999-09-28
- 发明人: Orlando F. Torres , Edgardo R. Hortaleza
- 申请人： Orlando F. Torres , Edgardo R. Hortaleza
- 申请人地址： TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： TX Dallas
- 主分类号： H01L21/607
- IPC分类号： H01L21/607 ; H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A method of bonding a wire between a semiconductor die pad and a lead finger of a lead frame which includes providing a capillary having a bore and a wire pigtail extending through the bore and externally of the capillary. A ball is formed with the pigtail, a semiconductor die pad is provided and a ball bond is formed on the die pad with the ball. A lead frame finger is provided and the capillary and the wire threaded through the bore are moved to the lead frame finger. A stitch bond is formed on the lead finger with the capillary. The capillary is moved from the stitch bond with a pigtail of the wire extending out of the bore of the capillary. A second ball is formed with the pigtail and the capillary is again moved toward the stitch bond until the second ball contacts the stitch bond. A ball bond is then formed over and secured to the stitch bond and to the lead frame finger. The wire is preferably a gold alloy and the wire bond location includes a copper trace adhered to a flexible electrically insulating film.
公开/授权文献
- US5413629A Laser marking and printing ink therefor 公开/授权日：1995-05-09
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