A mounting device for use with a printed circuit board solder machine having a pair of conveyors, where the printed circuit board is disposed between the conveyors for transport through the solder machine includes a body having a top and bottom portion. The top portion of the body includes structure for connecting the body to one of the pair of conveyors. A pair of spaced apart fingers extend between the top portion and the bottom portion of the body. The fingers are breakable when a predetermined pressure is exerted on the body to prevent damaged fingers from interfering with the operation of the solder machine. Structure is further provided on the fingers for grasping a printed circuit board.