To prevent increase in stress on a soldered join between a terminal pin and a circuit board in the event of thermal expansion, a support (22) with a larger diameter and a recess (21) with a smaller diameter are formed on a terminal pin (20). An alignment plate (30) is arranged to be movable with respect to a connector housing (11) between a support position in which the support member (22) is a close fit in a position fixing hole (31), and a release position in which the recess (21) is a loose fit. This eliminates the increase in stress on the soldered portion (M) due to differing rates of thermal expansion and contraction of the circuit board (P) and alignment plate (30).