发明授权
- 专利标题: Vertical extraction tool for semiconductor packaged devices
- 专利标题(中): 半导体封装器件的垂直提取工具
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申请号: US22444申请日: 1998-02-12
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公开(公告)号: US5979955A公开(公告)日: 1999-11-09
- 发明人: Mary Jane Krebser , Jeffrey Kaskey , Vernon Bollesen , James Jones
- 申请人: Mary Jane Krebser , Jeffrey Kaskey , Vernon Bollesen , James Jones
- 申请人地址: CA Palo Alto
- 专利权人: Sun Microsystems, Inc.
- 当前专利权人: Sun Microsystems, Inc.
- 当前专利权人地址: CA Palo Alto
- 主分类号: H05K7/14
- IPC分类号: H05K7/14 ; B25J15/10
摘要:
An extraction tool for extracting a module that is detachably connected to a mounting substrate includes a fixed plate that is vertically supported over the module to be extracted. A movable plate is arranged below the fixed plate and a screw is inserted in central openings in each of the fixed and movable plates. A pair of vertically extending side panels are connected at one edge by a hinge to opposite sides of the movable plate. The opposite edge of the respective side panels are used to grip the module to be extracted. A spring biases the side panels inwardly. A rotatable handle is arranged above the fixed plate and is connected to the screw. Lateral rotation of the handle causes a corresponding axial rotation of the screw for moving the movable plate in a vertical direction. The precise vertical movement of the plate also causes vertical movement of the side panels gripping the module which ensures that the module is extracted without any side-to-side or twisting motion, thereby avoiding damage to the connectors.
公开/授权文献
- US5334098A Playground device 公开/授权日:1994-08-02