Invention Grant
- Patent Title: Z-pin reinforced bonds for connecting composite structures
- Patent Title (中): 用于连接复合结构的Z形针增强粘结
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Application No.: US658927Application Date: 1996-05-31
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Publication No.: US5980665APublication Date: 1999-11-09
- Inventor: James J. Childress
- Applicant: James J. Childress
- Applicant Address: WA Seattle
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: WA Seattle
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B29C65/36 ; B29C65/50 ; B29C70/24 ; B29C70/44 ; B32B7/04 ; B64C3/26 ; B32B7/08 ; B32B31/26
Abstract:
I improve the impact shock resistance of bonds between composite elements by including Z-pin reinforcement. I prepare stubbled composite structure by using peel plys over the appropriate surface of the composite during pin insertion using conventional processes. I then use the stubbled composite structure with padups, as necessary, to produce the Z-pin reinforced joint or bond between composite elements using any of adhesive bonding, cocuring, or thermoplastic welding.
Public/Granted literature
- US5149451A Water soluble salt precoats for wire drawing Public/Granted day:1992-09-22
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