发明授权
- 专利标题： Semiconductor component having upper and lower mounting plates
- 专利标题（中）： 半导体元件具有上下安装板
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申请号： US43322申请日： 1998-03-20
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公开(公告)号： US5982029A公开(公告)日： 1999-11-09
- 发明人: Alfons Graf
- 申请人： Alfons Graf
- 申请人地址： DEX Munich
- 专利权人： Siemens Aktiengesellschaft
- 当前专利权人： Siemens Aktiengesellschaft
- 当前专利权人地址： DEX Munich
- 优先权： DEX19629768 19960723
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L23/495
摘要：
A metallic, lower mounting plate (21) is arranged in an insulating housing (20), a semiconductor body (23) with at least one logic part (24, 25) and at least one power part (26) with vertical MOS transistors being arranged on said lower mounting plate (21). A number of upper mounting plates (22) corresponding to the number of power parts (26) is introduced in the housing (20), said number of upper mounting plates (22) being electrically conductively secured on the upper sides of the power parts (26) of the semiconductor body (23) and being electrically connected to leads (4-6, 13-15). The lower leads covered by the upper leads are thereby recessed.
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