A built-in stress circuit for an integrated circuit that has a frequency generator, at least one self-test circuit, a temperature regulator and a controller is disclosed. The frequency generator receives a reference clock and an adjusted temperature frequency from the temperature regulator and outputs the test frequencies needed for the self-test circuits. The self-test circuits, which are coupled to the frequency generator, receive the test frequencies and dissipate power as the self-test circuits are being used. The temperature regulator, which is coupled to the self-test circuits and the frequency generator, senses the power dissipated (i.e., the temperature), adjusts a temperature frequency corresponding to the temperature desired, and outputs the adjusted temperature frequency. The controller, which is coupled to the frequency generator, the self-test circuits, and the temperature regulator, provides the control data necessary for testing both electrical and thermal stress conditions.