发明授权
US5987740A Laser machining of molded assemblies 失效
模制组件的激光加工

Laser machining of molded assemblies
摘要:
A heat generating component is encapsulated within an encapsulant. A window is made in the encapsulant to expose a heat dissipating surface of the component and a heat sinking device is attached to the heat dissipating surface of the heat generating component. The window is formed using a laser.
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