发明授权
- 专利标题: Cooling apparatus for electronic element
- 专利标题(中): 电子元件冷却装置
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申请号: US866634申请日: 1997-05-30
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公开(公告)号: US5992511A公开(公告)日: 1999-11-30
- 发明人: Yuichi Kodaira , Nobumasa Kodama , Toshiki Ogawara
- 申请人: Yuichi Kodaira , Nobumasa Kodama , Toshiki Ogawara
- 申请人地址: JPX Tokyo
- 专利权人: Sanyo Denki Co., Ltd.
- 当前专利权人: Sanyo Denki Co., Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX8-138333 19960531
- 主分类号: H05K7/20
- IPC分类号: H05K7/20 ; F25B21/02 ; H01L23/467 ; F28F7/00
摘要:
A heating element cooling apparatus which is capable of improving the cooling efficiency without greatly increasing the overall weight thereof. A heat sink 2 for the heating element cooling apparatus is equipped with an air fan 1. A heat conducting element 3 having higher heat conductivity than a base 2a of the heat sink 2 is conductivity attached to the base 2a. Plural radiation fins 6 are mounted on an extended portion 3c of the heat conducting element 3 which extends exceeding the base 2a. The heat generated by a heating element 4, which is heat-conductively attached on the heat conducting element 3, is outwardly conducted toward the peripheral portion of the heat sink through the heat conducting element 3 and radiated from the radiation fins 2b, resulting in increasing the radiation efficiency.
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