发明授权
- 专利标题: Liquid silicone rubber composition for application to high-voltage electrical insulators and articles
- 专利标题(中): 液体硅橡胶组合物适用于高压绝缘子和制品
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申请号: US104920申请日: 1998-06-25
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公开(公告)号: US5994461A公开(公告)日: 1999-11-30
- 发明人: Akito Nakamura , Yasumichi Shigehisa , Yuichi Tsuji
- 申请人: Akito Nakamura , Yasumichi Shigehisa , Yuichi Tsuji
- 申请人地址: JPX Tokyo
- 专利权人: Dow Corning Toray Silicone Co., Ltd.
- 当前专利权人: Dow Corning Toray Silicone Co., Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX9-184382 19970625
- 主分类号: C08K3/36
- IPC分类号: C08K3/36 ; C08L83/04 ; C08L83/05 ; C08L83/07 ; H01B3/46
摘要:
A high voltage electrical insulator formed from a curable liquid silicone rubber composition, and subsequently cured, a composition consisting essentially of(A) 100 weight parts of a fluid mixture of polyorganosiloxane comprising(a) at least 5 weight percent of a polyorganosiloxane resin comprising repeating units selected from the group consisting of SiO.sub.4/2 and RSiO.sub.3/2, where R is a monovalent hydrocarbon group, and(b) polydiorganosiloxane having a viscosity in the range from about 100 mPa.multidot.s to 100,000 mPa.multidot.s, that contains at least 2 silicon-bonded alkenyl groups in each molecule,(B) 1 to 100 weight parts microparticulate silica,(C) polyorganohydrogensiloxane that contains at least 2 silicon-bonded hydrogen atoms in each molecule, in a quantity that provides a value from 0.5:1 to 20:1 for the ratio of the number of moles of silicon-bonded hydrogen in the instant composition to the number of moles of silicon-bonded alkenyl in component (A), and(D) a catalytic quantity of a platinum catalyst.The liquid silicone rubber composition, prior to its cure, evidences a desirable fluidity and excellent moldability. Upon its cure the composition produces very mechanically strong silicone rubber moldings that have excellent high-voltage insulating properties tracking resistance, erosion resistance, arcing resistance without the use of fillers such as aluminum oxide, aluminum hydroxide or quartz.
公开/授权文献
- USD421661S Shop light 公开/授权日:2000-03-14
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