发明授权
- 专利标题: Substrate developing method and apparatus
- 专利标题(中): 基板显影方法及装置
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申请号: US725846申请日: 1996-10-04
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公开(公告)号: US6000862A公开(公告)日: 1999-12-14
- 发明人: Seiichiro Okuda , Kenji Sugimoto
- 申请人: Seiichiro Okuda , Kenji Sugimoto
- 申请人地址: JPX
- 专利权人: Dainippon Screen Mfg. Co. Ltd.
- 当前专利权人: Dainippon Screen Mfg. Co. Ltd.
- 当前专利权人地址: JPX
- 优先权: JPX7-291963 19951012
- 主分类号: H01L21/027
- IPC分类号: H01L21/027 ; B05C11/08 ; G03F7/30 ; G03D7/00 ; G03D5/00
摘要:
A substrate developing method and apparatus for improving uniformity of a developing process by adjusting a temperature gradient of a developer spread over the surface of a substrate. The developer is delivered to a central region of the substrate surface and spread over the surface. The developer in this state has activity diminishing, and thereby lowering the developing rate, gradually from center to edge of the substrate. With a gas flowing down around the edge of the substrate during the developing process, the developer vaporizes from peripheral regions of the substrate at an increased rate, thereby lowering the developer temperature in the peripheral regions. This increases the developing rate gradually from edge to center of the substrate. The uniformity of the developing process is improved by balancing the gradient of developing rate due to the temperature variation of the developer against the gradient of developing rate due to the lowering of developer activity.
公开/授权文献
- US4660124A Electrical circuit with high thermal dissipation 公开/授权日:1987-04-21
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