Invention Grant
- Patent Title: Method of forming salicide
- Patent Title (中): 形成自杀剂的方法
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Application No.: US62115Application Date: 1998-04-17
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Publication No.: US6001738APublication Date: 1999-12-14
- Inventor: Tony Lin , Water Lur , Shih-Wei Sun
- Applicant: Tony Lin , Water Lur , Shih-Wei Sun
- Applicant Address: TWX Taipei
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TWX Taipei
- Priority: TWX86108734 19970623
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/283
Abstract:
A method of forming salicide, of which the characteristics is the formation of a silicon nitride layer before the source/drain being implanted with dopant. The silicon nitride layer avoid the oxygen within the oxide layer to implant into the source/drain. Thus, a better salicide is obtained. In addition, the formation of the parasitic spacers made of silicon nitride at the side wall bottom of the gate spacer increases the distance between the salicide and the junction. Consequently, the leakage current is prevented. While the silicon nitride layer is removed, the polysilicon of gate and the silicon of the source/drain are amorphized. This is advantageous to the formation of salicide without the step of ion implantation.
Public/Granted literature
- USD399207S User interface Public/Granted day:1998-10-06
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