发明授权
US6001918A Silicone gel composition for use as a sealant and a filler for electrical and electronic components and a gel prepared from this composition 失效
用作密封剂的硅胶组合物和用于电气和电子部件的填料以及由该组合物制备的凝胶

Silicone gel composition for use as a sealant and a filler for
electrical and electronic components and a gel prepared from this
composition
摘要:
A silicone gel composition comprising: (A) 100 parts by weight of an organopolysiloxane containing at least two alkenyl groups per molecule and having a viscosity of 0.01 to 100 Pa.s at 25.degree. C.; (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule and having a viscosity of 0.001 to 10 Pa.s at 25.degree. C. in an amount sufficient to provide from 0.2 to 5 moles of silicon-bonded hydrogen atoms per one mole of alkenyl groups in component (A); (C) 0.01 to 15 parts by weight of a silica powder having a specific surface area of at least 50 m.sup.2 /g; (D) 0.0001 to 1.0 part by weight of a diamine compound represented by the following general formula: R.sup.1.sub.2 N--R.sup.2 --NR.sup.1.sub.2 wherein each R.sup.1 is independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R.sup.2 is an alkylene group having 2 to 4 carbon atoms; and (E) a hydrosilylation catalyst in a catalytic quantity; wherein the weight ratio of component (D) to component (C) in said gel composition is from 0.0005 to 0.05; and the silicone gel composition cures to form a silicone gel having a loss elastic modulus at 25.degree. C. and at a shear frequency of 0.1 Hz of from 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and a complex modulus of elasticity less than 1.0.times.10.sup.5 Pa.
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