发明授权
US6001918A Silicone gel composition for use as a sealant and a filler for
electrical and electronic components and a gel prepared from this
composition
失效
用作密封剂的硅胶组合物和用于电气和电子部件的填料以及由该组合物制备的凝胶
- 专利标题: Silicone gel composition for use as a sealant and a filler for electrical and electronic components and a gel prepared from this composition
- 专利标题(中): 用作密封剂的硅胶组合物和用于电气和电子部件的填料以及由该组合物制备的凝胶
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申请号: US110633申请日: 1998-07-06
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公开(公告)号: US6001918A公开(公告)日: 1999-12-14
- 发明人: Hiroji Enami , Akihiro Nakamura , Yuji Hamada , Takeaki Saiki
- 申请人: Hiroji Enami , Akihiro Nakamura , Yuji Hamada , Takeaki Saiki
- 申请人地址: JPX Tokyo
- 专利权人: Dow Corning Toray Silicone Co., Ltd.
- 当前专利权人: Dow Corning Toray Silicone Co., Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX9-200861 19970710
- 主分类号: C08L83/05
- IPC分类号: C08L83/05 ; C08K3/36 ; C08K5/17 ; C08L83/04 ; C08L83/07 ; H01L23/28 ; H01L23/29 ; H01L23/31 ; C08K3/34
摘要:
A silicone gel composition comprising: (A) 100 parts by weight of an organopolysiloxane containing at least two alkenyl groups per molecule and having a viscosity of 0.01 to 100 Pa.s at 25.degree. C.; (B) an organopolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule and having a viscosity of 0.001 to 10 Pa.s at 25.degree. C. in an amount sufficient to provide from 0.2 to 5 moles of silicon-bonded hydrogen atoms per one mole of alkenyl groups in component (A); (C) 0.01 to 15 parts by weight of a silica powder having a specific surface area of at least 50 m.sup.2 /g; (D) 0.0001 to 1.0 part by weight of a diamine compound represented by the following general formula: R.sup.1.sub.2 N--R.sup.2 --NR.sup.1.sub.2 wherein each R.sup.1 is independently a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R.sup.2 is an alkylene group having 2 to 4 carbon atoms; and (E) a hydrosilylation catalyst in a catalytic quantity; wherein the weight ratio of component (D) to component (C) in said gel composition is from 0.0005 to 0.05; and the silicone gel composition cures to form a silicone gel having a loss elastic modulus at 25.degree. C. and at a shear frequency of 0.1 Hz of from 1.0.times.10.sup.2 to 1.0.times.10.sup.4 Pa, and a complex modulus of elasticity less than 1.0.times.10.sup.5 Pa.
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