发明授权
- 专利标题： Semiconductor device, and lead frame used therefor
- 专利标题（中）： 半导体器件和引线框架
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申请号： US743047申请日： 1996-11-04
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公开(公告)号： US6005287A公开(公告)日： 1999-12-21
- 发明人: Yuiti Kaiya , Takehiko Takahashi , Takemitu Sato
- 申请人： Yuiti Kaiya , Takehiko Takahashi , Takemitu Sato
- 申请人地址： JPX Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-305332 19951124
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/48
摘要：
A semiconductor device in which a flat inner lead is connected to a semiconductor pellet so that a side edge of the inner lead is connected to the semiconductor pellet. The lead includes a constricted portion that is twisted so that the side edge faces a surface of the pellet to which the lead is connected. A lead frame is arranged so that the side edge can be twisted into position.
公开/授权文献
- US4726981A Strengthened glass articles and method for making 公开/授权日：1988-02-23
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