发明授权
- 专利标题： Semiconductor device and film carrier tape and respective manufacturing methods thereof
- 专利标题（中）： 半导体装置和薄膜载带及其制造方法
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申请号： US942481申请日： 1997-10-02
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公开(公告)号： US6011315A公开(公告)日： 2000-01-04
- 发明人: Kenji Toyosawa , Mitsuaki Ohsono
- 申请人： Kenji Toyosawa , Mitsuaki Ohsono
- 申请人地址： JPX Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JPX Osaka
- 优先权： JPX8-334326 19961213
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/28 ; H01L23/31 ; H01L23/495 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A semiconductor device is arranged so that a semiconductor chip is mounted on a film carrier which is composed of (1) an insulating base material tape having an opening section and (2) a conductive wiring having inner leads electrically connected to the semiconductor chip in the opening. The conductive wiring is provided on a main surface of the insulating base material tape. The film carrier is provided with an organic insulating film, which is different from the conductive wiring, covering the conductive wiring and the inner leads so as to support the inner leads.
公开/授权文献
- US5550102A Superconductor and method of manufacturing the same 公开/授权日：1996-08-27