Invention Grant
- Patent Title: Inspection method for a correction pattern
- Patent Title (中): 校正模式的检查方法
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Application No.: US135435Application Date: 1998-08-17
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Publication No.: US6016201APublication Date: 2000-01-18
- Inventor: Chin-Lung Lin , Yao-Ching Ku
- Applicant: Chin-Lung Lin , Yao-Ching Ku
- Applicant Address: TWX Taipei
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TWX Taipei
- Priority: TWX87109286 19980611
- Main IPC: G01N21/956
- IPC: G01N21/956 ; G01B11/00
Abstract:
An inspection method for a correction pattern includes the following steps. An optical proximity correction is performed to an original pattern to obtain an optical proximity correction pattern. An "exclusive or" logic operation is done to the original pattern and the optical correction pattern to obtain an inspection pattern. The inspection pattern includes a number of kinds of line width sizing. The line width sizing of the inspection pattern is then compared with an optical correction reference size.
Public/Granted literature
- US4878657A Sheet conveyance apparatus Public/Granted day:1989-11-07
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