A conductive laminate comprising an inorganic or organic substrate and a conductive layer formed on at least a part of a surface of said substrate, the conductive layer having a surface resistance at 25.degree. C., under 15% RH atmosphere of 10.sup.6 -10.sup.12 .OMEGA./.quadrature., a charge attenuation time of not more than 2 sec and a variation in surface resistance after heating at 250.degree. C. for one minute of not more than 5.0. The present invention provides an economical conductive laminate having antistatic performance even under low humidity, which performance being sufficient to overcome problems caused by static electricity, superior heat resistance and transparency, as well as superior characteristics of a structure such as a thermoplastic film.