发明授权
US6017795A Method of fabricating buried source to shrink cell dimension and
increase coupling ratio in split-gate flash
失效
埋入源的方法,以收缩电池尺寸并增加分流栅闪电中的耦合比
- 专利标题: Method of fabricating buried source to shrink cell dimension and increase coupling ratio in split-gate flash
- 专利标题(中): 埋入源的方法,以收缩电池尺寸并增加分流栅闪电中的耦合比
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申请号: US72996申请日: 1998-05-06
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公开(公告)号: US6017795A公开(公告)日: 2000-01-25
- 发明人: Chia-Ta Hsieh , Jenn Tsao , Di-Son Kuo , Yai-Fen Lin , Hung-Cheng Sung
- 申请人: Chia-Ta Hsieh , Jenn Tsao , Di-Son Kuo , Yai-Fen Lin , Hung-Cheng Sung
- 申请人地址: TWX Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company
- 当前专利权人: Taiwan Semiconductor Manufacturing Company
- 当前专利权人地址: TWX Hsin-Chu
- 主分类号: H01L21/8247
- IPC分类号: H01L21/8247 ; H01L27/115
摘要:
A method is provided for forming a split-gate flash memory cell having reduced size, partially buried source line, increased source coupling ratio, improved programmability, and overall enhanced performance. A split-gate cell is also provided with reduced size and improved performance. The source line is formed in a trench in the substrate over the source region. The trench walls provide increased source coupling and the absence of gate bird's beak with the trench together shrink the cell size. Programmability is also enhanced through more favorable hot electron injection though intergate oxide between the floating gate and the control gate.
公开/授权文献
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