发明授权
US6020048A Thick film circuit board and method of forming wire bonding electrode
thereon
失效
厚膜电路板及其上形成引线接合电极的方法
- 专利标题： Thick film circuit board and method of forming wire bonding electrode thereon
- 专利标题（中）： 厚膜电路板及其上形成引线接合电极的方法
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申请号： US941740申请日： 1997-10-01
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公开(公告)号： US6020048A公开(公告)日： 2000-02-01
- 发明人: Kengo Oka , Takashi Nagasaka
- 申请人： Kengo Oka , Takashi Nagasaka
- 申请人地址： JPX Kariya
- 专利权人： Denso Corporation
- 当前专利权人： Denso Corporation
- 当前专利权人地址： JPX Kariya
- 优先权： JPX8-262178 19961002
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L23/12 ; H01L23/498 ; H05K1/09 ; H05K3/32 ; B32B3/00
摘要：
A gold (Au) thick film land constituting a wire bonding electrode is formed by printing and sintering a gold (Au) thick film paste previously added with copper (Cu) to overlap with a copper (Cu) thick film which is formed as a wiring layer on a ceramic substrate. A semiconductor part mounted on the substrate and the gold (Au) thick film land are directly connected by a gold (Au) wire thereby electrically connecting the semiconductor part and the copper (Cu) thick film. In forming the gold (Au) thick film land, the gold (Au) thick film paste previously added with copper (Cu) is used. Therefore, disconnection caused by the Kirkendoll phenomenon is restrained and stable bonding between the copper (Cu) wiring layer and the gold (Au) thick film land can be achieved.
公开/授权文献
- US5299112A Support bar for adjustably mounted accessories 公开/授权日：1994-03-29