发明授权
- 专利标题: Dielectric laminated device and its manufacturing method
- 专利标题(中): 电介质层压装置及其制造方法
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申请号: US893289申请日: 1997-07-15
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公开(公告)号: US6020798A公开(公告)日: 2000-02-01
- 发明人: Hideaki Nakakubo , Toshio Ishizaki , Toru Yamada , Hiroshi Kagata , Tatsuya Inoue , Shoichi Kitazawa
- 申请人: Hideaki Nakakubo , Toshio Ishizaki , Toru Yamada , Hiroshi Kagata , Tatsuya Inoue , Shoichi Kitazawa
- 申请人地址: JPX Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX8-184593 19960715
- 主分类号: H01P1/203
- IPC分类号: H01P1/203 ; H01P7/08 ; H01P11/00
摘要:
By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.
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