发明授权
- 专利标题: Method of determining real time removal rate for polishing
- 专利标题(中): 确定抛光实时清除率的方法
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申请号: US235690申请日: 1999-01-22
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公开(公告)号: US6024628A公开(公告)日: 2000-02-15
- 发明人: Hsueh-Chung Chen
- 申请人: Hsueh-Chung Chen
- 申请人地址: TWX
- 专利权人: United Microelectronics Corp.
- 当前专利权人: United Microelectronics Corp.
- 当前专利权人地址: TWX
- 主分类号: B24B37/04
- IPC分类号: B24B37/04 ; B24B49/04 ; B24B49/12 ; B24B49/00 ; B24B51/00
摘要:
A method of determining a real time removal rate. A material layer is polished. During the polishing process, a light is incident onto the material layer continuously. The incident light is reflected from the material layer with a reflected light intensity. By integrating the reflected light intensity, followed by dividing the integration with a product of a differential of the reflected light intensity and the polishing time, an I-Dt transformation is obtained. The I-Dt transformation has a period which reflects the removal rate through calculation of optical principle.
公开/授权文献
- US4973510A Coated sheet material and process for producing same 公开/授权日:1990-11-27
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