发明授权
- 专利标题: Heat-curable epoxy resin composition
- 专利标题(中): 热固性环氧树脂组合物
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申请号: US40156申请日: 1998-03-17
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公开(公告)号: US6034200A公开(公告)日: 2000-03-07
- 发明人: Jae-Rock Lee , Soo-Jin Park , Sang-Bong Lee
- 申请人: Jae-Rock Lee , Soo-Jin Park , Sang-Bong Lee
- 申请人地址: KRX
- 专利权人: Korea Research Institute of Chemical Tech.
- 当前专利权人: Korea Research Institute of Chemical Tech.
- 当前专利权人地址: KRX
- 优先权: KRX97-8961 19970317
- 主分类号: C08G59/40
- IPC分类号: C08G59/40 ; C08G59/42 ; C08G59/50 ; C08G59/56 ; C08G59/58 ; C08G59/68 ; H05K1/03
摘要:
A heat-curable resin composition comprising a multifunctional epoxy resin monomer and a heat-latent curing agent of formula (I) provides a cured epoxy resin having good thermal and dimensional stability: ##STR1## wherein: R is hydrogen, a C.sub.1-4 alkyl or C.sub.1-4 alkoxy group.
公开/授权文献
- USD369983S Capacitive electronic sensor head 公开/授权日:1996-05-21