发明授权
- 专利标题: Cooling device boiling and condensing refrigerant
- 专利标题(中): 冷却装置沸腾冷凝制冷剂
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申请号: US24977申请日: 1998-02-16
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公开(公告)号: US6039111A公开(公告)日: 2000-03-21
- 发明人: Kiyoshi Kawaguchi , Shigeru Kadota , Kouji Kishita
- 申请人: Kiyoshi Kawaguchi , Shigeru Kadota , Kouji Kishita
- 申请人地址: JPX Kariya
- 专利权人: Denso Corporation
- 当前专利权人: Denso Corporation
- 当前专利权人地址: JPX Kariya
- 优先权: JPX9-030406 19970214; JPX9-066555 19970319; JPX9-066728 19970319
- 主分类号: F28D15/02
- IPC分类号: F28D15/02 ; H05K7/20
摘要:
A cooling device includes: a partition plate for partitioning an interior of a case into a first fluid passage through which first fluid having a high temperature flows and a second fluid passage through which second fluid having a low temperature flows; a heat receiving portion disposed in the first fluid passage; a heat radiating portion disposed in the second fluid passage; and a connection pipe for communicating the heat receiving portion and the heat radiating portion. The heat radiating portion is disposed at an upper side of the heat receiving portion in such a manner that the second fluid from a front side of the heat radiating portion flows into a rear side of the heat radiating portion through a pipe space between the heat radiating portion and the heat receiving portion, and further passes through the heat radiating portion from the rear side toward the front side of the heat radiating portion. Thus, the cooling device has a small size while improving the cooling capacity of the cooling device.
公开/授权文献
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