发明授权
US6054222A Epoxy resin composition, resin-encapsulated semiconductor device using
the same, epoxy resin molding material and epoxy resin composite tablet
失效
环氧树脂组合物，使用其的树脂封装的半导体器件，环氧树脂成型材料和环氧树脂复合片剂
- 专利标题： Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet
- 专利标题（中）： 环氧树脂组合物，使用其的树脂封装的半导体器件，环氧树脂成型材料和环氧树脂复合片剂
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申请号： US26338申请日： 1998-02-19
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公开(公告)号： US6054222A公开(公告)日： 2000-04-25
- 发明人: Hiromichi Takami , Kazutaka Matsumoto , Satoshi Takayama , Tetsuo Okuyama
- 申请人： Hiromichi Takami , Kazutaka Matsumoto , Satoshi Takayama , Tetsuo Okuyama
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX9-036011 19970220
- 主分类号： C08K3/36
- IPC分类号： C08K3/36 ; C08K5/00 ; H01L23/29 ; B32B17/10 ; B32B27/38
摘要：
An epoxy resin composition comprising (a) an epoxy resin, (b) a curing agent, (c) a cure accelerator and (d) silica powder. The silica powder (d) is composed of (d1) a first silica powder having a particle diameter ranging from 5 to 75 .mu.m, (d2) a second silica powder having a particle diameter ranging from 0.2 to 0.9 .mu.m, and (d3) a third silica powder having a particle diameter ranging from 0.01 to 0.08 .mu.m.
公开/授权文献
- USD365054S Tire 公开/授权日：1995-12-12
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