发明授权
- 专利标题： Deposition method of product molded with thermoplastic resin, and a depositing electrode to be used for this deposition method
- 专利标题（中）： 用热塑性树脂成型的产品的沉积方法和用于该沉积方法的沉积电极
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申请号： US312211申请日： 1999-05-14
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公开(公告)号： US6054679A公开(公告)日： 2000-04-25
- 发明人: Takeshi Ito , Hideaki Sakuma
- 申请人： Takeshi Ito , Hideaki Sakuma
- 申请人地址： JPX
- 专利权人： Tohoku Munekata Co., Ltd.
- 当前专利权人： Tohoku Munekata Co., Ltd.
- 当前专利权人地址： JPX
- 优先权： JPX10-132840 19980515
- 主分类号： H05B3/03
- IPC分类号： H05B3/03 ; B29C65/34 ; B29K101/12 ; H05B3/16
摘要：
A molded product is thermally bonded mutually with another molded product by disposing the resistance heating element (20) to the bonding face of product molded with the thermoplastic resin, making the bonding electrode (10) contact the resistance heating element (20) and by impressing the voltage for its heat generation. The heat generation temperature of the resistance heating element (20) at the voltage impressed portion (21) is suppressed to the level lower than the fusion temperature of resin by blowing the cooling gas toward the voltage impressed portion (21) from a vent hole (11) provided on the bonding electrode (10).
公开/授权文献
- USPP9258P Variety of lilium named `Holeca` 公开/授权日：1995-08-22
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