发明授权
US6055743A Method and apparatus for drying semiconductor wafers without forming
water markers thereon
失效
用于干燥半导体晶片而不在其上形成水标记的方法和设备
- 专利标题： Method and apparatus for drying semiconductor wafers without forming water markers thereon
- 专利标题（中）： 用于干燥半导体晶片而不在其上形成水标记的方法和设备
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申请号： US9158申请日： 1998-01-20
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公开(公告)号： US6055743A公开(公告)日： 2000-05-02
- 发明人: Yi-Nan Chen , Wen-Chi Hsu
- 申请人： Yi-Nan Chen , Wen-Chi Hsu
- 申请人地址： TWX
- 专利权人： Nanya Technology Corp.
- 当前专利权人： Nanya Technology Corp.
- 当前专利权人地址： TWX
- 优先权： TWX86117081 19971115
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; H01L21/00 ; F26B3/00
摘要：
A method and an apparatus for drying a semiconductor wafer. The semiconductor wafer is first dipped in a liquid with a volatility higher than water and which is miscible with water. The dipped semiconductor wafer is then delivered in an IPA dryer to carry out the drying process. The drying process includes evaporating isopropyl alcohol to obtain a vapor and condensing the IPA vapor on the surface of the semiconductor wafer. The IPA is heated and vaporized by a hot plate disposed at the bottom of the IPA dryer. The condenser is mounted on the inner peripheral surface of the IPA dryer and surrounds the semiconductor wafer, which is supported by a holder.
公开/授权文献
- USD357531S Air freshener 公开/授权日：1995-04-18
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