发明授权
- 专利标题： Method for forming bumps using dummy wafer
- 专利标题（中）： 使用伪晶片形成凸块的方法
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申请号： US237897申请日： 1999-01-27
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公开(公告)号： US6057168A公开(公告)日： 2000-05-02
- 发明人: Kiyotaka Seyama , Hideki Ota , Yasuhiro Usui , Kazuaki Satoh
- 申请人： Kiyotaka Seyama , Hideki Ota , Yasuhiro Usui , Kazuaki Satoh
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX10-099259 19980410
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/44
摘要：
A method for forming bumps including the steps of forming bumps on a dummy wafer. The dummy wafer is diced into dummy chips and the bumps formed on the dummy chips are inspected. Thus only good bumps are transferred to a real chip on which circuit patterns are formed.