Invention Grant
US6060219A Methods of forming electron emitters, surface conduction electron
emitters and field emission display assemblies
失效
形成电子发射体，表面传导电子发射体和场发射显示组件的方法
- Patent Title: Methods of forming electron emitters, surface conduction electron emitters and field emission display assemblies
- Patent Title (中): 形成电子发射体，表面传导电子发射体和场发射显示组件的方法
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Application No.: US83329Application Date: 1998-05-21
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Publication No.: US6060219APublication Date: 2000-05-09
- Inventor: David A. Cathey
- Applicant: David A. Cathey
- Applicant Address: ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: ID Boise
- Main IPC: H01J9/02
- IPC: H01J9/02 ; G03C5/00
Abstract:
A method of forming a surface conduction electron emitter is as follows. A first electrode and a second electrode are provided on a surface. The first and second electrodes are separated by a gap. A composition comprising particles and carrier material is provided over the surface. A portion of the composition that is over the surface is within the gap, and another portion of the composition that is over the surface is over the electrodes. The composition is exposed to a pattern of radiation to render the portion of the composition within the gap less soluble in a solvent than the portion of the composition that is over the electrodes. The composition is exposed to the solvent to remove an entirety of the portion of the composition that is over the electrodes while leaving the portion of the composition that is within the gap.
Public/Granted literature
- US4807108A Product realization method Public/Granted day:1989-02-21
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