发明授权
- 专利标题： Conductors for microelectronic circuits and method of manufacture
- 专利标题（中）： 微电子电路用导体及制造方法
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申请号： US960208申请日： 1997-10-29
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公开(公告)号： US6060388A公开(公告)日： 2000-05-09
- 发明人: Hiroyuki Akatsu , Russell H. Arndt , Bradley P. Jones , George F. Ouimet
- 申请人： Hiroyuki Akatsu , Russell H. Arndt , Bradley P. Jones , George F. Ouimet
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/3205
- IPC分类号： H01L21/3205 ; H01L21/768 ; H01L23/52 ; H01P3/06 ; H01L21/4763
摘要：
An integrated circuit (IC) conductor and the process of making the conductor. The conductor may be a monofilament conductor, a clad conductor or a coaxial conductor. A trench is formed in a dielectric layer. An outer material layer is deposited on the dielectric layer and in the trench, thick enough that the outer material layer merges together in a seam over the trench forming a void under the seam. The outer material layer is dielectric for the monofilament conductor, a cladding material for the clad conductor and conducting material for the coaxial conductor. The void is filled with a conductor for a monofilament or clad conductors. An inner dielectric liner layer is formed on the walls of the void and a core conductor is formed on the liner layer for the coaxial conductor.
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