Invention Grant
- Patent Title: Gate structure of a semiconductor device having an air gap
- Patent Title (中): 具有气隙的半导体器件的栅极结构
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Application No.: US56276Application Date: 1998-04-07
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Publication No.: US06064107APublication Date: 2000-05-16
- Inventor: Wen-Kuan Yeh , Tony Lin , Heng-Sheng Huang
- Applicant: Wen-Kuan Yeh , Tony Lin , Heng-Sheng Huang
- Applicant Address: TWX Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TWX Hsin-Chu
- Priority: TWX87101752 19980210
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/423 ; H01L29/49 ; H01L29/00
Abstract:
A semiconductor device comprises a semiconductor substrate, a source/drain region formed in the substrate, a gate oxide layer on the substrate between the source/drain region, a conductive layer on the gate oxide layer, a spacer around a side wall of the gate, and an air gap between the gate and the spacer. The spacer is not directly connected with the gate. The air gap is formed between the gate and the spacer.
Public/Granted literature
- USD382918S Toy UFO Public/Granted day:1997-08-26
Information query
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