发明授权
US6071667A Photosensitive resin composition containing a photosensitive polyamide
resin
失效
含有感光性聚酰胺树脂的感光性树脂组合物
- 专利标题： Photosensitive resin composition containing a photosensitive polyamide resin
- 专利标题（中）： 含有感光性聚酰胺树脂的感光性树脂组合物
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申请号： US630478申请日： 1996-04-10
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公开(公告)号： US6071667A公开(公告)日： 2000-06-06
- 发明人: Hideo Hagiwara , Yasunori Kojima , Makoto Kaji , Mitsumasa Kojima , Haruhiko Kikkawa
- 申请人： Hideo Hagiwara , Yasunori Kojima , Makoto Kaji , Mitsumasa Kojima , Haruhiko Kikkawa
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi Chemical Co., Ltd.
- 当前专利权人： Hitachi Chemical Co., Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-088059 19950413
- 主分类号： C08G73/10
- IPC分类号： C08G73/10 ; G03F7/037 ; G03F7/038 ; H05K1/00 ; G03F7/012
摘要：
A polyimide precursor having repeating units of the formula: wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.
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