Invention Grant
- Patent Title: Semiconductor component
- Patent Title (中): 半导体元件
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Application No.: US287282Application Date: 1999-04-07
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Publication No.: US06072238APublication Date: 2000-06-06
- Inventor: Lakshminarayan Viswanathan , David F. Abdo , Gerald R. Miller
- Applicant: Lakshminarayan Viswanathan , David F. Abdo , Gerald R. Miller
- Applicant Address: IL Schaumburg
- Assignee: Motorola, Inc.
- Current Assignee: Motorola, Inc.
- Current Assignee Address: IL Schaumburg
- Main IPC: H01L23/66
- IPC: H01L23/66 ; H01L23/34
Abstract:
A semiconductor device (10) suitable for use in RF applications and a method of forming the semiconductor device (10). An RF transistor die (31) is bonded to a heatsink (21). The heatsink (21) having the semiconductor chip (31) mounted thereto is coupled to a printed circuit board (11), wherein the RF transistor die (31) extends through an opening (14) in the printed circuit board (11). Conductors (18, 19) on the printed circuit board (11) are coupled to the semiconductor chip (31) via wirebonds (35, 36).
Information query
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