发明授权
- 专利标题： Method of fabricating a semiconductor device using a CMP process
- 专利标题（中）： 使用CMP工艺制造半导体器件的方法
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申请号： US902278申请日： 1997-07-29
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公开(公告)号： US6086454A公开(公告)日： 2000-07-11
- 发明人: Yoshio Watanabe , Kenichi Kawashima
- 申请人： Yoshio Watanabe , Kenichi Kawashima
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX8-320046 19961129
- 主分类号： H01L21/304
- IPC分类号： H01L21/304 ; B24B57/02 ; H01L21/00 ; B24B1/00
摘要：
A polishing apparatus includes a rotatable platen, a first driving device for causing the rotatable platen to rotate, a polishing head provided above the platen rotatably and holding a substrate in a manner such that the substrate faces the platen, a second driving device for causing the polishing head to rotate, an urging device for urging the substrate on the polishing head against the platen, a slurry feeding system for feeding a slurry to the platen, and a cleaning system for supplying a cleaning liquid containing an acid that dissolves a manganese oxide, to the polishing head. The cleaning system includes a nozzle provided in the polishing head for spraying the cleaning liquid to the platen.
公开/授权文献
- USD353613S Cash register 公开/授权日：1994-12-20
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