发明授权
US6087719A Chip for multi-chip semiconductor device and method of manufacturing the
same
失效
用于多芯片半导体器件的芯片及其制造方法
- 专利标题： Chip for multi-chip semiconductor device and method of manufacturing the same
- 专利标题（中）： 用于多芯片半导体器件的芯片及其制造方法
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申请号： US64984申请日： 1998-04-23
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公开(公告)号： US6087719A公开(公告)日： 2000-07-11
- 发明人: Yoshitaka Tsunashima
- 申请人： Yoshitaka Tsunashima
- 申请人地址： JPX Kawasaki
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX9-109130 19970425
- 主分类号： H01L25/18
- IPC分类号： H01L25/18 ; H01L21/768 ; H01L21/98 ; H01L23/48 ; H01L23/64 ; H01L25/065 ; H01L25/07 ; H01L25/10 ; H01L23/02
摘要：
A plurality of chips each having two or more alignment holes for transmitting a laser beam are stacked. The laser beam is irradiated onto the uppermost or lowermost one of the stacked chips. A photodetector detects the laser beam output from the stacked chips through the alignment holes in these chips. The positions of the chips are so controlled that the amount of the light detected by this photodetector is a maximum.
公开/授权文献
- USD397412S Handle for a plumbing fitting 公开/授权日：1998-08-25
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