发明授权
- 专利标题： Semiconductor pellet having plural chips
- 专利标题（中）： 具有多个芯片的半导体芯片
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申请号： US920905申请日： 1997-08-29
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公开(公告)号： US6091156A公开(公告)日： 2000-07-18
- 发明人: Masaaki Kinoshita
- 申请人： Masaaki Kinoshita
- 申请人地址： JPX Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX8-232357 19960902
- 主分类号： H01L25/18
- IPC分类号： H01L25/18 ; H01L21/02 ; H01L21/60 ; H01L21/822 ; H01L23/485 ; H01L23/495 ; H01L25/04 ; H01L25/065 ; H01L27/04 ; H01L23/48
摘要：
A semiconductor pellet comprising first and second semiconductor chips being diced from a wafer, a first bonding-pad formed at a first peripheral portion of said first chip, and a second bonding-pad formed at second peripheral portion of said second chip, which bonding-pads are arranged so as to keep symmetry after rotating around the central point of said pellet by 180 degrees. Judging whether the first chip is good or not and if the chip is not good, then the pellet is rotated around the central point thereof by 180 degrees, and it is mounted onto a chip carrier. Then wire-bonding is conducted.
公开/授权文献
- US5235289A Transmission power amplifier device 公开/授权日：1993-08-10