发明授权
US6100181A Low dielectric constant coating of conductive material in a damascene process for semiconductors 有权
半导体镶嵌工艺中导电材料的低介电常数涂层

Low dielectric constant coating of conductive material in a damascene
process for semiconductors
摘要:
A method for manufacturing an integrated circuit using damascene processes is provided in which planar surfaces subjected to chemical-mechanical polishing are protected by a protective low dielectric constant coating. The coatings are of organic silicon materials which are spun on and baked in preparation of the deposition of subsequent dielectric layers.
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