发明授权
US6100365A Soluble polyimide resin, process for preparing the same, and polyimide
resin solution composition
失效
可溶性聚酰亚胺树脂，其制备方法和聚酰亚胺树脂溶液组合物
- 专利标题： Soluble polyimide resin, process for preparing the same, and polyimide resin solution composition
- 专利标题（中）： 可溶性聚酰亚胺树脂，其制备方法和聚酰亚胺树脂溶液组合物
-
申请号： US125852申请日： 1999-04-12
-
公开(公告)号： US6100365A公开(公告)日： 2000-08-08
- 发明人: Toshihiko Matsumoto , Toshikazu Kurosaki , Shin Irie , Masaaki Kudo , Yoshiharu Ito , Masao Kaneko
- 申请人： Toshihiko Matsumoto , Toshikazu Kurosaki , Shin Irie , Masaaki Kudo , Yoshiharu Ito , Masao Kaneko
- 专利权人： Maruzen Petrochemical Co Ltd
- 当前专利权人： Maruzen Petrochemical Co Ltd
- 优先权： JPX8-358731 19961227; JPX9-246122 19970827
- 主分类号： C08G73/10
- IPC分类号： C08G73/10 ; C08L79/08 ; C09D179/08 ; C08G69/28
摘要：
The present invention provides a novel soluble polyimide resin which is superior in solubility in solvents and transparency, which is useful particularly in electronics and optronics fields, and which has good processability; a process for production of the resin; and a solution composition of the resin. A soluble polyimide resin containing, as part or the whole of the diamine units, a 2,5(or 6)-bis(aminomethyl)bicyclo[2.2.1]heptane and having a light transmittance of 60% or more in a range of wavelength larger than 400 nm in an ultraviolet-visible light spectrum measured for a film of 10-.mu.m thickness; a process for production of the resin; and a solution composition of the resin.
公开/授权文献
- US4857131A Two-part adhesive for bonding plastics and metals 公开/授权日：1989-08-15
信息查询
