Invention Grant
- Patent Title: Fine wire of gold alloy, method for manufacture thereof and use thereof
- Patent Title (中): 金合金细线，其制造方法及其用途
-
Application No.: US110905Application Date: 1998-07-06
-
Publication No.: US6103025APublication Date: 2000-08-15
- Inventor: Gunther Herklotz , Jurgen Reuel , Lutz Schrapler , Christoph Simons
- Applicant: Gunther Herklotz , Jurgen Reuel , Lutz Schrapler , Christoph Simons
- Applicant Address: DEX Hanau
- Assignee: W. C. Heraeus GmbH & Co. KG
- Current Assignee: W. C. Heraeus GmbH & Co. KG
- Current Assignee Address: DEX Hanau
- Priority: DEX19728871 19970707; DEX19733954 19970806
- Main IPC: C22F1/00
- IPC: C22F1/00 ; C22C5/02 ; C22F1/14 ; H01L21/60 ; H01L23/485 ; H01L23/49 ; C22C5/00
Abstract:
Fine wires of a gold alloy of 0.05 to 0.95 wt % platinum, palladium or a mixture thereof; 0.001 to 0.1 wt % mischmetal containing at least 50 wt. % of cerium; and 0 to 0.1 wt % of alkaline earth metal. The wire has a favorable strength-to-elongation ratio and is suitable both for wire bonding and for making the ball bumps of flip chips.
Public/Granted literature
- USD424463S Combined child safety alarm and transmitter Public/Granted day:2000-05-09
Information query
