发明授权
- 专利标题： Semiconductor thermal protection arrangement
- 专利标题（中）： 半导体热保护装置
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申请号： US337095申请日： 1999-06-21
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公开(公告)号： US6108206A公开(公告)日： 2000-08-22
- 发明人: Joseph Criniti , Javier I. Larranaga , Edward E. Kim , Esteban Santos , Nathaniel B. Vicente
- 申请人： Joseph Criniti , Javier I. Larranaga , Edward E. Kim , Esteban Santos , Nathaniel B. Vicente
- 申请人地址： NY Schenectady
- 专利权人： General Electric Company
- 当前专利权人： General Electric Company
- 当前专利权人地址： NY Schenectady
- 主分类号： H01L23/467
- IPC分类号： H01L23/467 ; H05K7/14 ; H05K7/20
摘要：
A cooling assembly for semiconductor devices in the form of an enclosure including an inlet and outlet with a semiconductor support assembly is presented. The air passage connection with the inlet defines vortex configuration for the rapid transport of compressed air to the semiconductor devices arranged between the enclosure inlet and outlet.
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