发明授权
US6109507A Method of forming solder bumps and method of forming preformed solder
bumps
失效
形成焊锡凸块的方法和形成预成型焊料凸块的方法
- 专利标题： Method of forming solder bumps and method of forming preformed solder bumps
- 专利标题（中）： 形成焊锡凸块的方法和形成预成型焊料凸块的方法
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申请号： US79521申请日： 1998-05-15
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公开(公告)号： US6109507A公开(公告)日： 2000-08-29
- 发明人: Harumi Yagi , Noritsugu Ozaki , Tsuyoshi Yamamoto , Toshiyuki Nakada , Takeshi Komiyama , Yoshihito Okuwaki
- 申请人： Harumi Yagi , Noritsugu Ozaki , Tsuyoshi Yamamoto , Toshiyuki Nakada , Takeshi Komiyama , Yoshihito Okuwaki
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX9-308802 19971111
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/60 ; H05K3/12 ; H05K3/34 ; B23K31/02 ; H05K3/32
摘要：
A method of forming solder bumps on pads provided on a board, wherein a plurality of solder bump layer forming cycles are repeatedly implemented. Each of the solder bump layer forming cycles includes the steps of printing solder paste on the board using a mask having mask openings and heating the solder paste so as to fuse the solder paste for forming solder bumps.
公开/授权文献
- USD414507S Toner cartridge 公开/授权日：1999-09-28