发明授权
- 专利标题： Plastic package with exposed die and method of making same
- 专利标题（中）： 具有裸露模具的塑料封装及其制造方法
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申请号： US195350申请日： 1998-11-18
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公开(公告)号： US6117710A公开(公告)日： 2000-09-12
- 发明人: Shahram Mostafazadeh , Joseph O. Smith
- 申请人： Shahram Mostafazadeh , Joseph O. Smith
- 申请人地址： CA Santa Clara
- 专利权人： National Semiconductor Corporation
- 当前专利权人： National Semiconductor Corporation
- 当前专利权人地址： CA Santa Clara
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/68 ; H01L23/31 ; H01L21/44 ; H01L21/48 ; H01L21/50
摘要：
A molded plastic package incorporates a lead frame which includes a plurality of leads radially aligned around a central opening. A die is mounted in the central opening and is electrically connected to the leads by wire bonding. A molded plastic casing is formed over the die, wiring and lead frame to encapsulate the package. The lower surfaces of the die and lead frame are exposed through the package. A method for making the molded plastic package includes mounting the die and lead frame onto an adhesive tape, electrically connecting the die to the leads by wire bonding, forming a molded plastic casing over the die, wire bonding and lead frame, and then removing the adhesive tape to expose the lower surfaces of the die and the lead frame.
公开/授权文献
- USRE33929E Central injection device for internal combustion engines 公开/授权日：1992-05-19
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