发明授权
US6117772A Method and apparatus for blanket aluminum CVD on spherical integrated
circuits
失效
球形集成电路上用于毯式铝CVD的方法和装置
- 专利标题: Method and apparatus for blanket aluminum CVD on spherical integrated circuits
- 专利标题(中): 球形集成电路上用于毯式铝CVD的方法和装置
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申请号: US113671申请日: 1998-07-10
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公开(公告)号: US6117772A公开(公告)日: 2000-09-12
- 发明人: Ivan Herman Murzin , Toshiyuki Sakuma , Ajay Tapiawala
- 申请人: Ivan Herman Murzin , Toshiyuki Sakuma , Ajay Tapiawala
- 申请人地址: TX Allen
- 专利权人: Ball Semiconductor, Inc.
- 当前专利权人: Ball Semiconductor, Inc.
- 当前专利权人地址: TX Allen
- 主分类号: H01L21/285
- IPC分类号: H01L21/285 ; H01L21/44
摘要:
A method and apparatus for metal-organics chemical vapor deposition (MO CVD) of a metal layer upon a spherical substrate at atmospheric pressure are disclosed. The method includes pretreating the spherical substrate with a vapor of a first precursor in preparation for a deposition of a metal layer. The pretreated spherical substrate is then exposed to a thermally dissociated precursor of metal for depositing the metal layer onto the spherical substrate, wherein the exposure to the thermally dissociated precursor of metal provides a uniformly deposited metal layer coverage over the pretreated spherical substrate. The deposited metal layer is then annealed and cooled.
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