Invention Grant
- Patent Title: Modular connector with printed circuit board
- Patent Title (中): 带印刷电路板的模块化连接器
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Application No.: US286284Application Date: 1999-04-05
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Publication No.: US6120307APublication Date: 2000-09-19
- Inventor: Paul E. Nagel , Brent Madsen , David Oliphant , Joshua Randall , Ryan A. Kunz
- Applicant: Paul E. Nagel , Brent Madsen , David Oliphant , Joshua Randall , Ryan A. Kunz
- Applicant Address: CA Santa Clara
- Assignee: 3Com Corporation
- Current Assignee: 3Com Corporation
- Current Assignee Address: CA Santa Clara
- Main IPC: H01R31/06
- IPC: H01R31/06 ; H01R13/44 ; H01R13/60
Abstract:
A connector includes a modular housing having a jack slidably disposed thereto. The housing includes a substantially U-shaped frame having a cover mounted thereon. A printed circuit board (PCB) is secured to the frame and has an elongated center finger extending between the opposing side walls of the frame. A plurality of partially exposed contact lines are formed on the center finger of the PCB. The jack includes a slide plate having an aperture extending therethrough and a channel communicating with the aperture. The aperture is configured to receive a media plug. Mounted on the slide plate so as to be positioned over the channel is a pin block. The pin block has a plurality of elongated slots formed therein. The slots face the channel and are separated by insulating walls. Disposed within each of the elongated slots is a substantially S-shaped pin. Each pin has a tail end that is mounted to the pin block, a downwardly curved portion that extends within the channel, and an opposing lead end which is freely disposed within the aperture of the slide plate. The center finger of the PCB is slidably received within the channel of the slide plate such that the jack can be selectively moved between an extended position and a retracted position.
Public/Granted literature
- US5622669A Process and apparatus for the vulcanizing of tires Public/Granted day:1997-04-22
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