A portable electric soldering tool includes a housing forming a handle and a power head. A heating rod with a main and a secondary heating coil extends from the power head, the rod having an axial bore with a stainless steel lining to prevent solder from building up in the heating rod. A pump draws molten solder through the axial bore of the heating rod. A disposable solder collecting cartridge is removably mounted in the power head to collect solder drawn through the heating rod. The cartridge includes a barrel formed of a heat resistant plastic. Sealing gaskets are disposed at the open ends of the barrel, and a solder accumulator is disposed in the barrel to collect molten solder. The main and secondary heating coils are connected to a power switch. An electric motor for the pump is connected in series with the secondary heating coil. A selector switch energizes alternatively the main heating coil or the secondary heating coil and motor.