发明授权
- 专利标题: Anti-reflection oxynitride film for tungsten-silicide substrates
- 专利标题(中): 硅化钨衬底的抗反射氧氮化物膜
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申请号: US18100申请日: 1998-02-03
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公开(公告)号: US6133613A公开(公告)日: 2000-10-17
- 发明人: Liang-Gi Yao , John Chin-Hsiang Lin , Hua-Tai Lin
- 申请人: Liang-Gi Yao , John Chin-Hsiang Lin , Hua-Tai Lin
- 申请人地址: TWX Hsinchu
- 专利权人: Vanguard International Semiconductor Corporation
- 当前专利权人: Vanguard International Semiconductor Corporation
- 当前专利权人地址: TWX Hsinchu
- 主分类号: H01L21/027
- IPC分类号: H01L21/027 ; H01L21/3213 ; H01L23/58
摘要:
The present invention provides an anti-reflection film for lithographic application on tungsten-silicide containing substrate. In one embodiment of the present invention, a structure for improving lithography patterning in integrated circuit comprises a tungsten-silicide layer, a diaphanous layer located above the tungsten-silicide layer, an anti-reflection layer located above the diaphanous layer, and a photoresist layer located above the anti-reflection layer for patterning the integrated circuit pattern.
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